- 2008 lg45030-pf/tbs-x a doc. no : qw0905- rev. : date : 13 - apr. lg45030-pf/tbs-x data sheet ligitek electronics co.,ltd. property of ligitek only tape and box type led lamps pb lead-free parts
2.4 9.6 25.0min 1.0min 0.5 typ 1.5 max 4.9 2.54typ + - note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. lg45030-pf ligitek electronics co.,ltd. property of ligitek only package dimensions lg45030-pf/tbs-x part no. page1/6 t d l h2 h1 w0 w2 p2 w3 p1 w1 p f - + h
2/6 page ligitek electronics co.,ltd. property of ligitek only part no. typical electrical & optical characteristics (ta=25 # ) absolute maximum ratings at ta=25 # note : 1.the forward voltage data did not including ! 0.1v testing tolerance. 2. the luminous intensity data did not including ! 15% testing tolerance. viewing angle 2 $ 1/2 (deg) min. 20 min. forward voltage @ ma(v) max. lens peak wave length % pnm spectral halfwidth &% nm luminous intensity @10ma(mcd) typ. emitted part no material green lg45030-pf/tbs-x gap color unit ma ma ' a # # mw 30 120 g ratings 10 ir -40 ~ +85 -40 ~ +100 80 forward current peak forward current duty 1/10@10khz parameter operating temperature storage temperature reverse current @5v power dissipation symbol t opr tstg i f pd i fp green diffused 565 30 1.7 2.6 4.5 8.0 65 lg45030-pf/tbs-x
mminch 340 275 2.4 10.8 13.4 maxmum lg45030-pf/tbs-x dimension symbol information ? feed hole to bottom of component feed hole to overall component height lead length after component height mm 330 265 dimensions symbol information ? remark:tbs=tape and box straight leads lead location quantity/box overall thickness overall width overall length h w l description symbol adhesive tape width adhesive tape position tape width feed hole location overall taped package thickness center of component location feed hole pitch component lead pitch front-to-rear deflection tape feed hole diameter symbol items part no. 5.8 0.17 4.4 p1 ------- 0.23 2000pcs package dimensions ? inch 60 1.97 10.4 50 13.0 specification minimum w1 ------- ------- ------- w3 w2 ------- ------- ------- t w0 p2 15.5 0.57 14.5 0.69 17.5 00 19 4.0 ------- 0.2 0.33 ------- 8.5 5.1 1.42 9.75 7.7 0.61 0.75 0.16 0.06 0.38 0.3 tbs-13 ------- ------- ------- l p h2 tbs-10 tbs-12 tbs-11 19.0 0.71 18.0 ------- 0.49 w0 12.4 ------- 11 13 36 0.83 0.72 0.81 20.5 21.0 18.4 21.5 19.4 22.0 tbs-7 tbs-9 tbs-8 tbs-6 h1 tbs-3 tbs-5 tbs-2 tbs-1 0.94 0.75 0.96 0.78 19.0 24.5 24.0 19.9 20.0 25.5 25.0 20.9 0.85 0.89 1.0 0.69 22.5 25.5 21.5 17.5 23.5 26.5 22.5 18.5 0.75 0.43 0.51 1.42 0.85 0.76 0.87 1.0 0.79 0.98 0.82 1.04 0.93 0.89 0.73 ligitek electronics co.,ltd. property of ligitek only maximum page 3/6 ------- ------- ------- f h d option code symbol mm inch mm 0.15 ------- 0.09 2.3 ------- 3.8 3.0 2.0 4.2 specifications minimum inch 0.12 0.08 0.17
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) page forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 g chip part no. fig.6 directive radiation 4/6 lg45030-pf/tbs-x
5 /sec max note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 260 c3sec max dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) ligitek electronics co.,ltd. property of ligitek only soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) 60 seconds max 0 0 25 120 50 preheat 2 /sec max 260 temp( c) 2.wave soldering profile part no. lg45030-pf/tbs-x time(sec) 150 100 page 5/6
this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. solder resistance test 1.t.sol=260 5 2.dwell time= 10 1sec. mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 this test intended to see soldering well performed or not. solderability test 1.t.sol=230 5 2.dwell time=5 1sec mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. ligitek electronics co.,ltd. property of ligitek only the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) low temperature storage test thermal shock test high temperature high humidity test high temperature storage test operating life test 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) part no. test item reliability test: lg45030-pf/tbs-x test condition description mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202:103b jis c 7021: b-11 mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 page 6/6 reference standard
|
